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BMF60N190C1

BMF60N190C1 is power MOSFET using bestirpower's advanced super junction technology that can realize very low on resistance and gate charge.It will provide much high efficiency by using optimized charge coupling technology. These user friendly devices give an advantage of Low EMI to designers as well as low switching loss.
Availability:

Applications

• PC power.

• Server power supply.

• Telecom.

• Solar invertor.

• Super charger for automobiles.


Features

BVDSS@ TJ,max

ID

RDS(on),max

Qg,typ

650 V

20 A

190 mΩ

40 nC

• Ultra-fast body diode.

• Extremely low losses due to very low FOM

• Rdson*Qg and Eoss.

• Very high commutation ruggedness.

BMF60N190C1.1


Absolute Maximum Ratings (TJ=25°C unless otherwise noted)

Symbol

Parameter

Value

Unit

VDSS

Drain to Source Voltage1)

650

V

VGS Gate to Source Voltage ±30 V
ID

Drain Current2)

VGS = 10 V, (TC = 25℃)

20

A

VGS = 10 V, (TC = 100℃)

12

A

IDM Drain Current

Pulsed

60

A

EAS Single Pulsed Avalanche Energy3) 282 mJ
IAR Avalanche Current 7.5 A
dv/dt MOSFET dv/dt 50 V/ns
Peak Diode Recovery dv/dt4) 50
PD

Power Dissipation

(TC = 25℃)

34

W

TJ, TSTG Operating and Storage Temperature Range -55 to 175
TL Maximum Lead Temperature for Soldering,  1/8” from Case for 10 Seconds 260

1) Limited by Tj max. Maximum duty cycle D=0.75.

2) Pulse width tp limited by Tj,max.

3) VDD=50V, RG=25Ω, Starting Tj=25°C.

4) VDClink=400V; VDS,peak<V(BR)DSS; identical low side and high side switch with identical RG.



Thermal Characteristics

Symbol

Parameter

Value

Unit

RθJC

Thermal Resistance, Junction to Case, Max.

3.67

°C/W

RθJA

Thermal Resistance, Junction to Ambient, Max.

62.5

°C/W


Electrical Characteristics (TJ=25°C unless otherwise noted)

Symbol Parameter Test Conditions Min Typ Max Unit
Off Characteristics
BVDSS Drain to Source Breakdown Voltage VGS= 0 V, ID= 1 mA 600 - - V
lDSS Zero Gate Voltage Drain Current VGS= 600 V, VGS= 0 V,  TJ = 25℃ - - 1 μA
lGSS Gate-Source Leakage Current VGS= +20 V, VGS= 0 V - - ±100 nA
On Characteristics
VGS(th) Gate Threshold Voltage VGS= VDS, ID= 250μA 2.5 3.5 4.5 V
RDS(on) Static Drain to Source On Resistance VGS= 10 V, ID= 23 A,  TJ = 25℃ - 160 190
Dynamic Characteristics
Ciss Input Capacitance VGS= 0 V, VDS= 50V, f=  250 kHz - 1690 - pF
Coss Output Capacitance - 78 -
Crss Reverse Capacitance - 3.3 -
Co(tr) Time Related Output Capacitance1) VDS = 0 V to 400 V, VGS = 0 V - 245 - pF
Co(er) Energy Related Output Capacitance2) - 50 -
Qg(tot) Total Gate Charge at 10 V VDD= 400 V, ID = 7 A,  VGS = 0 to 10 V - 40 - nC
Qgs Gate to Source Charge - 9 -
Qgd Gate to Drain “Miller” Charge - 17 -
Vplateau Gate plateau voltage - 6 - V
RG Gate resistance f=1 MHz , open drain - 7 - Ω
Switching Characteristics
td(on) Turn-On Delay Time VDD = 400 V, ID = 7 A, VGS = 10 V - 64 - ns
tr Turn-On Rise Time - 16 -
td(off) Turn-Off Delay Time - 55 -
tr Turn-Off Fall Time - 14 -
Source-Drain Diode Characteristics
VSD Diode Forward Voltage VGS = 0 V, IF = 23 A, TJ = 25℃ - 0.85 - V
trr Reverse Recovery Time VR = 400 V, IF = 23 A, diF/dt = 100 A/μs
- 320 - ns
Qrr Reverse Recovery Charge - 2.5 - nC
Irrm Peak Reverse Recovery Current - 14 - A

1) Co(tr) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 400V.

2) Co(er) is a fixed capacitance that gives the same stored energy as Coss while VDS is rising from 0 to 400V.


Typical Performance Characteristics


Figure-1.-Power-dissipation

Figure 1. Power dissipation

Figure-2.-Max.-transient-thermal-impedance

Figure 2. Max. transient thermal impedance

Figure-3.-Safe-operating-area

Figure 3. Safe operating area


Figure-4.-Typ.-output-characteristics

Figure 4. Typ. output characteristics

Figure-5.-Typ.-output-characteristics

Figure 5. Typ. output characteristics

Figure-6.-Typ.-drain-source-on-state-resistance

Figure 6. Typ. drain-source on-state resistance


Figure-7.-Drain-source-on-state-resistance

Figure 7. Drain-source on-state resistance

Figure-8.-Typ.-transfer-characteristics

Figure 8. Typ. transfer characteristics

Figure-9.Typ.-gate-charge

Figure 9.Typ. gate charge


Figure-10.-Forward-characteristics-of-reverse-diode

Figure 10. Forward characteristics of reverse diode

Figure-11.-Drain-source-breakdown-voltage

Figure 11. Drain-source breakdown voltage


Figure-12.-Typ.-capacitancest

Figure 12. Typ. capacitancest

Figure-13.-Typ.-Coss-stored-energy

Figure 13. Typ. Coss stored energy


Figure-15.-Diode-Characteristics

Figure 15. Diode Characteristics

Figure-16.-Switching-Times

Figure 16. Switching Times

Figure17.UnclampedInductiveLoad

Figure17.UnclampedInductiveLoad


Package Outlines TO247-3

TO-220F


SYMBOL

MIN

NOM

MAX

E

10.00

10.20

10.40

A

4.50

4.70

4.90

A1

2.34

2.54

2.74

A2

0.65

0.85

1.30

A4

2.55

2.75

2.95

c

0.40

0.50

0.65

d

15.57

15.87

16.17

H1

6.70REF

e
2.54BSC

φP

3.183REF

L

12.68

13.13

13.28

L1

3.25

3.45

3.65

φP3

3.45REF

F3

3.10

3.30

3.50

G3

1.10

1.30

1.50

61

1.05

1.20

1.35

b2

0.70

0.80

0.92

* Dimensions in millimeters


Package Marking and Ordering Information

Part Number

Top Marking

Package

Packing Method

Quantity

BMF60N190C1

BMF60N190C1

TO220F-3

Tube

350 units


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ChipETech Ltd. is a fab-lite semiconductor company based in China. We specialize in next-generation power semiconductor solutions, including chip design, device R&D, production, sales, and application services.

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